GPU CPU Backplate Copper Heatsink Round Pipe 5mm x 110mm - Passive

Our review of the GPU CPU Backplate Copper Heatsink Round Pipe assesses whether this single-piece copper heat pipe is a practical, low-profile cooling upgrade for enthusiasts and technicians. The bottom line: it is best for users who need a compact, passive thermal solution for GPU, CPU backplates, VRAM or laptop IC chips and value copper construction plus internal thermal fluid for faster heat transfer. The product stands out because the manufacturer highlights a thermal fluid inside the copper tube that boosts responsiveness and conductive performance beyond plain metal alone.

Key Features

• Material and construction: Solid copper tube filled with thermal fluid provides greater heat exchange than bare metal, improving passive dissipation on tight builds.
• Compact size: At 110mm long and 5mm diameter the pipe fits under backplates and in laptop cooling tight spaces where larger heatsinks will not.
• Passive operation: No fan required, so it adds cooling capacity without extra noise or power draw for quieter systems.
• Custom processing available: Bending and flattening services allow the tube to be shaped to specific layouts or contact areas when needed.
• Versatile use: Intended for GPU and CPU backplates, VRAM and LED modules, making it useful across multiple internal component cooling tasks.
• Targeted contact ends: One sharp end contacts the heat source while the smooth end functions as the dissipation surface for effective heat transfer.

Who It's For

This heatsink pipe suits DIY system builders, repair technicians, and laptop modders who need a small, passive copper heat pipe to augment backplate or chipset cooling. It is also useful when silence is required because it bolsters heat spread without additional fans.

It is not ideal for users seeking a full active cooling replacement for a high-TDP CPU or GPU; those with heavy continuous thermal loads should look for larger vapor chamber solutions or fan-assisted radiators instead.

Pros & Cons

Pros

• High thermal responsiveness from a copper tube with internal thermal fluid helps move heat away from concentrated hotspots.
• Small 5mm diameter and 110mm length fit tight spaces and allow placement on backplates or laptop chipsets.
• Passive, fanless design adds cooling without noise or additional power needs.
• Available bending and flattening services let installers adapt the tube to specific contact surfaces.

Cons

• As a single passive pipe, it is a modest cooling aid and not a replacement for active cooling on very high-heat components.
• Limited off-the-shelf sizes may require custom processing for unusual layouts.

Specifications

Brand	Bopaodao
Material	Copper with thermal fluid
Length	110mm
Diameter	5mm
Quantity	1Pcs
Processing options	Bending and flattening on request

Our Verdict

The Bopaodao copper heatsink pipe is a sensible, low-cost option for anyone needing targeted, passive cooling on backplates, VRAM, or laptop ICs; its internal thermal fluid and copper construction give it a clear edge over plain metal rods, but it works best as a supplement to active cooling for high-power components.

Frequently Asked Questions

Can this pipe be bent to fit my layout?
Yes, the seller offers bending and flattening services so the tube can be shaped to specific contact points if you message them with requirements.

Is this a drop-in replacement for a GPU or CPU cooler?
No, it is designed as a passive backplate or chipset heatsink and is not a full active cooler replacement for high-TDP processors.

Will it work in laptops?
Yes, the small diameter and 110mm length make it suitable for laptop IC chipsets and tight internal spaces where a thin passive heat pipe is required.