GPU CPU Backplate Copper Heatsink Round Pipe 5mm x 120mm - Passive
GPU CPU Backplate Copper Heatsink Round Pipe 5mm x 120mm - Passive
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Our review of the GPU CPU Backplate Copper Heatsink Round Pipe summarizes who will benefit most from this simple, metal heat transfer solution and why it stands out for compact cooling projects. This is a single 120mm, 5mm-diameter copper heat pipe designed as a passive heatsink tube that pairs with graphics card backplates, CPU backplates, laptop IC chipsets, VRAM and LED modules. The bottom line: for builders who need a small, fanless copper heat conductor with bending and flattening options, this component delivers reliable thermal conduction and flexible installation options.
Key Features
- Copper construction: Solid copper material ensures durable thermal conduction from hot components to a dissipation surface.
- Thermal fluid inside: The internal thermal fluid boosts heat transfer and responsiveness beyond simple solid metal conduction.
- 120mm length, 5mm diameter: Compact dimensions make it easy to fit into laptop repairs, tight GPU backplates and small LED module assemblies.
- Bend and flatten services: The vendor offers customization so the tube can be shaped to a specific layout or flattened for better surface contact.
- Passive, fanless operation: Designed to improve heat dissipation without extra power draw or moving parts, suitable for quiet systems.
- Sharp and smooth ends: A pointed end mates with the heat source while the smooth end spreads heat to the dissipation area for predictable performance.
Who It's For
This heatsink tube is aimed at PC and laptop hobbyists, system builders and technicians who need a compact, passive method to move heat from a chipset, VRAM or small CPU to a backplate or radiator. It is particularly useful where space is limited and fans either cannot be used or are undesirable.
It is not intended as a complete cooling solution for high-end desktop GPUs or heavy overclocking where active cooling and larger heatpipes or full radiators are required. Professionals needing certified thermal modules or drop-in replacements with guaranteed performance charts should look to full heatpipe assemblies instead.
Pros & Cons
Pros
- Compact 120mm length and 5mm diameter fit into tight spaces for targeted cooling upgrades.
- Copper plus internal thermal fluid offers improved thermal responsiveness over plain solid rods.
- Customization options for bending and flattening let installers adapt the tube to exact layouts.
Cons
- As a single passive tube, it is best for supplemental cooling rather than replacing full active cooling solutions.
- Performance details are qualitative; buyers must judge suitability from dimensions and material rather than numeric thermal ratings.
Specifications
| Brand | Bopaodao |
| Material | Copper with thermal fluid |
| Length | 120mm |
| Diameter | 5mm |
| Application | GPU/CPU backplate, laptop IC chipset, VRAM, LED modules |
| Customization | Bending and flattening services available |
| Lead time (non-FBA) | 7-10 business days |
Our Verdict
The Bopaodao 5mm x 120mm copper heatsink tube is a practical, low-cost component for quiet, compact cooling upgrades where a passive heat conductor is needed. It is best for DIY repairs, laptop chipset cooling and supplemental VRAM or LED thermal management; buyers who need heavy-duty active cooling should combine this tube with larger radiators or fans for best results.
Frequently Asked Questions
Can this tube be bent to fit my layout?
Yes, the seller provides bending and flattening services so you can request shaping to specific requirements.
Is this a complete cooling solution for high-performance GPUs?
No, this single passive tube is intended to supplement cooling or move heat to a dissipation surface; high-performance GPUs need larger active cooling systems.
What parts can this be used with?
It is suitable for GPU/CPU backplates, laptop IC chipsets, VRAM modules and LED modules where space and fanless operation are priorities.
Editor's Take
The 5mm x 120mm copper heatsink tube is a practical, low-cost passive solution for compact cooling upgrades, offering good thermal conduction and customization for tight installations.

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